Wednesday, May 18, 2011

ChipEstimate.com launches first third-party IP portal localized for vital Japanese design community

SAN JOSE, USA & YOKOHAMA, JAPAN: ChipEstimate.com has launched ChipEstimate.jp, a Japanese-language version of the world’s largest IP and chip planning portal. ChipEstimate.jp allows Japanese IC designers to evaluate and explore third-party IP in their native language, providing access to a global ecosystem of IP from over 200 of the world’s largest IP suppliers and foundries.

The site also makes it easier for Japanese IP suppliers to join, potentially expanding an already extensive database of over 8,000 pieces of IP and, in turn, giving those suppliers access to the over 30,000 users in the global ChipEstimate.com community. Spending roughly $337 million for third-party IP in 2010, Japan represents one of the largest markets for third-party IP consumption.

“Japan is one of the leading regions for IC design in the world, and designers are increasingly turning to IP as a key weapon in their battle against growing IC design complexity,” said Adam Traidman, general manager of ChipEstimate.com. “Until now, however, Japanese designers really haven’t had access to native language tools that enable them to evaluate a broad range of third-party IP, and conduct sophisticated chip planning and estimation using that IP. By filling this void, ChipEstimate.jp has the potential to open the market for more extensive IP reuse throughout the region, while also giving Japanese IP suppliers a new outlet for marketing their solutions.”

With Japanese menus, navigation links, buttons, forms, and more, the site allows users to search for IP by a variety of criteria including function, quality and node. Users can then explore the IP in more detail by linking to additional information such as datasheets, technical articles, white papers and videos. Further, users can select IP of interest and access industry leading chip planning and estimation tools, allowing them to estimate key metrics about their next chip design such as die size, power and cost.

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