MIGDAL HAEMEK, ISRAEL: Camtek Ltd announced that it has received repeat orders for Automatic Optical Inspection (AOI) systems. The application is advanced Micro Bump inspection and metrology from a leading foundry based in Asia. The systems will be installed during the second and third quarter of 2011.
Advanced Micro Bump and Through-Silicon-Via technology combine vertical stacking of integrated circuits. This enables "more than Moore" end-product performance, lower power consumption, a smaller footprint and reduced overall cost. Camtek's AOI provides a complete solution allowing a combination of high performance 2D and 3D metrology and inspection capabilities on the same platform.
"The technology of 3D integrated circuits (3DIC), is trending to advanced micro bumps of below 10 mm and may reach up to 1 million bumps per die. With this technology trend, there are significant challenges in the measurement of the small bumps, including the efficient handling of huge amounts of data" commented Roy Porat, Camtek's CEO.
"The 3DIC technology is a significant driver in our market, and we are very pleased with the fact that we are the tool of choice in the selection by this very important customer. I believe that we will see further orders from this customer in the future."