3rd Asia Symposium on Quality Electronic Design (ASQED) announces program

SAN JOSE, USA & KUALA LUMPUR, MALAYSIA: The third Asia Symposium on Quality Electronic Design (ASQED) announced its 2011 program consisting of several keynotes by industry leaders and university experts, tutorials and over 50 technical presentations

ASQED is being held on July 19-20, 2011 in Kuala Lumpur, Malaysia. ASQED plays a critical role in promoting quality-based electronic design and manufacturing in Asia and plans to be an integral part of establishing a communication link between semiconductor, nano-electronic, bio-electronic, MEMS (microelectromechanical) and NEMS (nanoelectromechanical) systems, and photovoltaic (PV) technologies and disciplines such as design, manufacturing, test and packaging.

ASQED keynote sessions are sponsored by Synopsys and include:

Nanotechnology and the Challenges Facing Designers of Circuits and Systems
Prof. Arokia Nathan
Chair of Nanotechnology, London Centre for Nanotechnology,
University College London, England

Electronics for Energy Management
Dr. Bernard Courtois
Director of CMP and TIMA, France

The Packaging Technology Domain
Prof. Younggap You
Dean of College of Electrical and Computer Engineering, Chungbuk National University, Korea

Challenges in Interconnection
Dr. ChoonHeung Lee
Head of Corp. Technology, Amkor, Korea

Advances in High Density Interconnections-Promoting Innovations and Lower Costs
Happy Holden
Chief Technical Officer, Foxconn Advanced Technology, Taiwan

Tutorials
ASQED is pleased to offer the following tutorials by industry experts:

A Tool Box for Successful 3D Integration
Mark Scannell
Program Director, 3D Integration
CEA – Léti, France

Modern 3D Packaging Technologies Driving the Need for IC, Package and Printed Circuit Board (PCB) Co-Design Methodologies
John Park
Methodology Architect
Mentor Graphics, USA

Memory Packaging Challenges and Approaches for the Evolving World of the Portable Client and Cloud
Richard Crisp
Principal Technologist
Tessera, USA

3D Silicon Interposer and Through Silicon Via (TSV): Application, Requirement, Infrastructure and Technologies
Farhang Yazdani
President and CTO
BroadPak Corporation, USA

Technical Sessions
The ASQED technical sessions consist of over 50 papers by engineers and researchers worldwide.