Yole's integrated passive devices (IPDs) report 2009

LYON, FRANCE: Thin film Integrated Passive and Active Devices (IPDs) market is set to grow from more than $600 million this year to over $1 billion by 2013.

From a commodity technology initially developed to replace bulky discrete passive components, thin-film IPD’s are now a growing industry trend driven by ESD/EMI protection, RF, high brightness LEDs, digital and mixed signal applications.

Yole is pleased to announce the first complete study on Thin Film Integrated Passive & Active Devices.

Whether it is to reduce space on the application board, to enhance performance or to reduce cost at the system level, IPD’s are spreading to most electronic sectors, from low volume to mass market businesses in aerospace, military, medical, industrial, lighting, communications, and PC applications.

Over the past few years, IPDs have become an essential enabler of System-in-Packages (SiP) realizations. Looking to tomorrow, IPD’s are paving the way to the bright future of the “More than Moore” heterogeneous integration as they contribute greatly to bridging the increasing gap between the evershrinking geometries of CMOS ICs and the lagging packaging technologies.

IPDs enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units and digital processors.

At the frontier between the back-end and the front-end of the semiconductor industry, Thin-film IPDs are poised to extend the use of Wafer-Level Packaging (WLP) and Through silicon Via (TSV) technology platforms to many IC package solutions as well as to the discrete passive component industry.

Being a “bridge platform”, IPDs involve the complete semiconductor value chain: equipment; material providers; fabless semiconductor players; integrated device manufacturers; CMOS foundries; MEMS players; substrate suppliers; and OSAT industry, are all concerned by the need to increase their value proposition in the future through the extensive integration of thin film integrated passive and active devices.

In this report, you will find comprehensive links between the different IPD technologies and each of their applications. Market share, supply value chain and strategies of the current major players and those looking at entering this business have been identified.

IPD technology trends, manufacturing options and challenges to be addressed are discussed and detailed. Finally, a complete market segmentation for the commercialization of IPD’s is proposed.Market forecasts and attached growth rates for each segment are provided for 2008-2015.