PHOENIX, USA: FlipChip International - (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that its engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.
Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same wafer. These can be design variations of a single base IC, to help optimize functional performance, or many completely different ICs with different die sizes.
FCI has created thousands of product and MPW designs for customers around the world, and partners with many Semiconductor manufacturers and foundries to enable them to test out hundreds of new IC designs and sample their customers with bumped ICs without going to the cost of creating individual mask sets for each new IC.
FCI's ability to design, manufacture, and inspect a large number of MPW designs, as well as full-production designs, places them at the cutting edge of advanced Wafer Level Package development.