GRENOBLE, FRANCE: On January 19-21, 2015, SEMI will hold its 3rd edition of the European 3D TSV Summit in Grenoble, France.
After the last successful edition that brought over 330 participants from over 21 countries in January 2014, SEMI will renew the Summit in 2015 with the theme: “Enabling Smarter Systems,” focusing on the critical chip integration that 3D through silicon vias (TSV) now play in business strategies and the latest technology advancements.
After a long period of development, disruptive TSV technology is now transitioning to the commercialization stage and delivering higher performance, lower power consumption and reduced footprint products to enable overall smarter system integration. Companies like SK Hynix, Micron or Samsung are manufacturing engineering samples and some are even ramping up the production of stacked memories with TSV.
Bosch, a leading MEMS company, is proposing 3-axis accelerometers with TSV. Sony is manufacturing 3D stacked backside illuminated Image Sensors with TSV in the logic die. Xilinx, pioneer of TSV with its VIRTEX 7 in 28nm, announced their next generation FPGA products Kintex and Virtex Ultra Scale in 20 and 16nm stacked die on interposer.
These examples of recent product launches and announcements from major semiconductor companies make it more relevant than ever to attend this year’s TSV Summit to learn about future opportunities.
The event will be the platform for over 20 invited speakers from design houses, IDMs, OSATs, as well as from equipment and materials suppliers to share their views during plenary presentations and panel discussions. Executives and experts from leading global companies will address the latest business and technological issues pressing the industry — including cost of ownership, business models, supply chain, manufacturability and other technological aspects.
The European 3D TSV Summit will address the most relevant and controversial issues related to 2.5 and 3D manufacturing. Companies will also have the opportunity to showcase their products and services in the exhibition zone. In addition to the exhibit and conference, attendees will have the opportunity to schedule on-site business meetings through the event’s online business meeting platform and to visit the CEA-Leti 300mm TSV-capable clean room.
This year’s European 3D TSV Summit Steering Committee includes executives from: ams AG, BESI, CEA-Leti, EV Group, Fraunhofer-IZM, imec, Oerlikon Systems, Scint-X, SPTS, STMicroelectronics, and SUSS Microtec.