Friday, September 12, 2014

ST drives MEMS industry evolution in IoT era

GENEVA, SWITZERLAND: STMicroelectronics announced that Benedetto Vigna, executive VP and  GM of ST’s Analog, MEMS and Sensors Group,  delivered a featured speech at the MEMS Industry Group (MIG) Conference Shanghai.

The two-day event explored the global MEMS and Sensors supply chain, with particular focus on Internet of Things (IoT) opportunities in Asia. Vigna will share his thoughts on ST’s leading role and how MEMS and Sensors enable the next wave of smart IoT devices.

In the past decade, motion-sensing technologies have transformed the way people interact with electronic devices and ST played an important role in developing and pioneering the deployment of "motion sensing" to a large variety of smart consumer applications.

Now, a wide variety of sensing technologies makes man-machine interfaces more natural and intuitive, influencing all aspects of people’s lives. Sensors are pervading everyday objects that become intelligent and context-sensitive, bringing new and exciting ways of understanding and interacting with the world around us.

“MEMS and Sensor suppliers will drive the IoT growth through continuous innovation and diversification of their product portfolio complemented with a robust and reliable high-volume supply chain and strong partner cooperation. The geo-economic specifics also need to be taken into account by developing the right products and support models for markets such as Asia,” said Vigna.

“ST continues to lead the industry evolution with its advanced technology and product portfolio that covers all key building blocks for IoT – MEMS sensors and actuators, together with embedded processing, power, and connectivity.”

With almost 5 billion MEMS sensors and 3.5 billion MEMS actuators sold in the market to date together with complete control of its design and production processes, ST is the one-stop MEMS supplier of choice, offering a comprehensive portfolio of micro-machined accelerometers, gyroscopes, pressure sensors, magnetic sensors, and microphones, and has the capability to integrate these in multi-sensor combos with on-board signal processing, control functions, sensor-fusion algorithms, and wireless connectivity.

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