USA: In the last 10 years, the semiconductor industry has undergone a considerable amount of change driven by the need to increase integration to meet rising customer expectations of performance and functionality.
In the System-on-Chip (SoC) market this has been accomplished by the increasing use of discrete third party semiconductor Intellectual Property (SIP) blocks of all types to aid SoC designers in crafting ever more complex silicon solutions.
The IP subsystem is a new method designers will employ to infuse the right level of complexity and functionality to meet quickly changing market requirements without experiencing a corresponding increase in design costs or design cycle time.
A new research report from Semico, The IP Subsystems Market: Evolution Continues and Momentum Builds, forecasts that the basic SoC IP subsystems segment will reach 351.1M units by 2017.
"Most of these evolutionary forces are driven by the need to integrate more functionality in fewer devices at the system level and in ever-smaller system footprints," says Rich Wawrzyniak, senior analyst.
"One method to accomplish this is through the use of third party SIP. However, as design costs and time-to-market pressures mount on SoC designers, it is becoming more difficult for these designers to accomplish their tasks in a timely and cost-effective manner. This then sets the stage for the next evolutionary leap with the introduction of the IP subsystem. "
Key findings of this new research include:
* The Americas market will experience strong growth over the forecast period to $340.5 million by 2017.
* The IP subsystems market will reach a CAGR of 30.7 percent through 2017.
* The Chinese market will have a CAGR of 32.2 percent through 2017.
Value Multicore SoCs are the second-largest user of IP subsystems, reaching a CAGR of 15.3% by 2017.