Tuesday, March 20, 2012

RDA Microelectronics selects Teradyne UltraFLEX test system for RF test

NORTH READING, USA: Teradyne announced that RDA Microelectronics, a fabless semiconductor company that designs, develops and markets Radio Frequency (RF) and mixed-signal semiconductors for cellular, connectivity and broadcast applications, has chosen to test mobile SOC devices using Teradyne’s UltraFLEX-HD test system, along with the UltraPAC80, UltraPin1600, UltraWave 12G and UltraVI80 instruments, based on performance, time-to-market and cost-of-test.

The UltraFLEX offers a wide range of coverage when the device mix and throughput goals demand the highest speed, precision, coverage and capacity for superior multisite test efficiency. It achieves lower cost of test through faster test times and higher parallel efficiency. And the UltraFLEX-HD does it all in a compact 2m x 2m footprint.

"We selected the UltraFLEX to test our high-performance RF SOC devices because it offers one of the highest accuracies among RF test equipment in the market, especially at low-power levels, and meets the requirements of our customers’ applications," said Zhao GuoGuang, VP of Operations at RDA Microelectronics. "This equipment produces the best yields possible for critical tests and allows us to guarantee our product quality. Additionally, the throughput and parallel test efficiency of the UltraFLEX allows us to meet our aggressive product test cost objectives."

“RDA is one of China’s leading mobile IC providers, and we are very pleased with its selection of the UltraFLEX, the ideal production solution for complex, leading-edge SOC devices," said Gregory Smith, Teradyne Computing and Communications Business Unit manager. "We believe RDA will be a key beneficiary of the growth and evolution of the mobile ecosystem, and we look forward to working with the company and its worldwide manufacturing partners to support their continued expansion.”

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