MINNEAPOLIS, USA: FSI International Inc., a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, announced that several semiconductor producers have placed additional orders for ANTARES Cryokinetic Cleaning Systems.
These device providers currently use the ANTARES systems for numerous particle removal processes. Unlike aqueous technologies, Cryokinetic cleaning technology is uniquely qualified for particle removal application because of its all-dry defect removal method. The systems are expected to ship during fiscal 2012.
The ANTARES System is a fully automated, single-wafer, Cryokinetic system used for processing 200/300mm wafers with capabilities to remove nanoscale particles. Cryokinetic processing technology is an all-dry, chemical free process that removes particles through impact by high-velocity cryogenic Ar/N2 aerosol, and reduces defects without damaging the wafer surface, even on copper and porous low-k films.
The system’s highly efficient dry cleaning solution can be used for a variety of particle removal applications in FEOL and BEOL. Many of the leading logic device manufacturers worldwide utilize the ANTARES system for its defect reduction and yield improvement benefits.
Monday, November 14, 2011
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