FSI receives follow-on order for ORION system from leading semiconductor producer

MINNEAPOLIS, USA: FSI International Inc., a leading manufacturer of surface conditioning equipment for microelectronics manufacturing, received a follow-on order for its ORION Single Wafer Cleaning System from a leading semiconductor producer. The system will be used for BEOL applications. The company expects to ship the system during the first half of fiscal 2012.

Leading integrated circuit manufacturers are recognizing that the closed chamber technology of the ORION system, when used for BEOL applications, delivers highly efficient removal of etch and ash by-products without causing galvanic corrosion or changes in metal and dielectric film properties. The process chamber design with an integrated spray bar, improves uniformity, shortens process time, reduces chemical consumption and enhances particle removal.

FSI International is a global supplier of surface conditioning equipment, technology and support services for microelectronics manufacturing. Using the company’s broad portfolio of cleaning products, which include batch and single-wafer platforms for immersion, spray and cryogenic aerosol technologies, customers are able to achieve their process performance flexibility and productivity goals. The company’s support services programs provide product and process enhancements to extend the life of installed FSI equipment, enabling worldwide customers to realize a higher return on their capital investment.