Tuesday, May 17, 2011

Akrion Systems ships single wafer system to Asia

ALLENTOWN, USA: Akrion Systems LLC, a supplier of advanced surface preparation processes and equipment for microelectronics and solar device manufacturers, announced that the company has placed a Velocity single wafer tool at a leading edge memory products manufacturer in Asia for the purpose of demonstrating its pre-lithography cleaning capabilities.

Velocity is Akrion Systems' most advanced single-wafer platform and more than sixty single wafer systems are currently installed. The platform employs controlled physical force technologies, ultra-dilute chemicals and de-ionized and functional water for critical cleaning applications. Velocity's technology advantages are focused on the Goldfinger front- and back-side megasonics.

The megasonics deliver very high particle removal efficiency with very low critical dimension loss and no damage. The system has the capability of simultaneous defect removal from the front, back and bevel edge of the wafer, thus offering a significant cost of ownership advantage. Velocity can be configured to perform a variety of applications including sensitive structure defect removal, pre-lithography cleaning, back side and bevel edge cleaning, TSV cleaning and resist stripping.

Michael Ioannou, Akrion Systems president and CEO, said: "The stellar performance of our Velocity system has been proven in the volume production of various advanced devices in numerous state-of-the-art fabs worldwide. We are excited to have this opportunity to expand our installed base and prove to a new customer the many advantages of our single wafer platform."

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