IDT RapidIO Gen2 switch selected for high speed interconnect on TI TCI6616 wireless base station evaluation module

SAN JOSE, USA: Integrated Device Technology Inc. (IDT) announced that its IDT CPS-1616 RapidIO Gen2 switch has been selected by Texas Instruments Inc. (TI) for its new TMDXEVM6616 evaluation module (EVM).

Now, designers can begin development on TI’s TCI6616 wireless base station System-on-Chip (SoC) for low latency, high performance and robust features to prototype 3G/4G wireless systems, significantly improving time to market. The inherent efficiency and software scalability of RapidIO in clustering large numbers of digital signal processors (DSPs) and Field Programmable Gate Arrays (FPGAs) on boards and over backplanes makes it the most effective interconnect choice for today’s wireless systems.

The IDT CPS-1616 belongs to IDT’s extensive portfolio of RapidIO Gen2 switches, supporting up to 20 Gbps per link for use as a chip-to-chip, board-to-board, and chassis-to-chassis interconnect.

RapidIO enables OEMs in the 4G wireless and industrial markets to design embedded systems with clusters of DSPs that communicate in a peer-to-peer fashion while also providing high reliability, very low 100ns cut through latency, and simplified system memory maps. The use of RapidIO in TI’s TCI6616 EVM is a testament to the widespread adoption of the interconnect standard within the wireless infrastructure market.