KLA-Tencor and TEL announce SpectraShape dimensional metrology systems With AcuShape2 next-generation modeling capability

MILPITAS, USA: KLA-Tencor Corp. announced the SpectraShape 8660 and 8810 dimensional metrology systems, featuring AcuShape2 modeling software developed jointly with Tokyo Electron Ltd (TEL).

The new SpectraShape tools are able to fully characterize the three dimensional shapes of complex features on integrated circuits (ICs)—and monitor these shapes at production speeds. The exceptional performance of these new tools is critical when engineers are faced with complicated structures such as high-k metal gates, where sub-nanometer profile variations can have significant impact on transistor performance, or dual-damascene contacts, where a small modulation in the bottom diameter can seriously impact device yield or reliability.

Despite considerable process control challenges, IC manufacturers have begun to incorporate geometrically complex structures in order to garner more performance from each square centimeter of a silicon wafer. For these structures, the top-down view that a critical dimension scanning electron microscope (CD-SEM) provides may not be sufficient for ensuring that the structures are being built to specifications.

KLA-Tencor's new SpectraShape systems use a diverse array of optical technologies to characterize the structures comprehensively and rapidly. Patented algorithms combine and analyze the multiple signals to produce a detailed description of the shape of an IC feature and identify any deviations beyond allowed tolerances. With their multi-channel design, the SpectraShape 8660 and 8810 systems have broad applicability across the IC fab, from the early layers of leading-edge transistors to the last interconnect layers.

"One of the challenges of introducing complex shapes into the circuit design is that there are more ways for small process variations to affect device performance," said Ahmad Khan, VP and GM of KLA-Tencor's Films and Scatterometry Technologies (FaST) division. "Our engineers have built the new SpectraShape systems for extraordinary flexibility, precision and repeatability to meet our customers' next-generation shape metrology requirements."

Optical dimensional metrology requires advanced mathematical modeling to interpret the signals from the hardware, and the new AcuShape2 software streamlines the modeling process for both KLA-Tencor's standalone and TEL's integrated metrology (IM) systems.

"The new AcuShape2 software package accelerates the process of building robust, usable 3D shape models," said Jim Hamajima from Timbre Technologies, a wholly owned subsidiary of TEL and KLA-Tencor's partner in developing the 3D modeling software that powers the new SpectraShape systems. "We've also introduced a user interface that allows fab engineers to build models on their own—keeping the details of their proprietary IC structures within the walls of the fab."

The broad capabilities of the SpectraShape 8660 and 8810 with AcuShape2 are enabled by the following features:
* Full-featured, flexible hardware with patented ability to combine signals from multiple channels to characterize highly complex IC structures.
* New model building user interface, designed for use by fab engineers with or without assistance from outside experts.
* Accelerated model building and reduced measurement time compared with previous-generation KLA-Tencor optical CD tools.

The SpectraShape 8810 differs from the 8660 by adding a deep ultraviolet (DUV) illumination option to improve sensitivity for advanced materials.