The worldwide IC packaging market

DUBLIN, IRELAND: Research and Markets has announced the addition of the "The Worldwide IC Packaging Market" report to its offering.

After an unprecedented five years of continuous market growth, the semiconductor industry faltered in late 2009 as the global economic crisis struck hard. So, where is the industry headed now and what are the implications for the IC packaging industry? New Venture Research (NVR), in the 2010 Edition of The Worldwide IC Packaging Market, analyzes the semiconductor industry and uses this analysis to forecast the future of the global IC packaging market.

The report begins with NVRs views on the state of the semiconductor industry, along with a top level forecast. This discussion includes factors bearing on individual semiconductor products as well as global economic factors. The financial performance of the publicly-traded SATS companies is also addressed.

Following this high-level review, the report presents forecasts for each semiconductor product type, and segments these products by package family and I/O count range. Packaging revenue figures are displayed for each segment, based on prices charged in the contract assembly market. The package families are then rolled up by I/O count and semiconductor product. In doing so, the report generates the total value of the IC packaging industry.

Next, the report presents NVRs continuing, extensive coverage of the packaging contractor market. Packaging contractors will continue to assume a larger share of the world's IC packaging business. The report breaks the contractor market down by package families and major product categories providing units and revenue for each category.