Microsemi expands DDR3 SDRAM family with 4GByte solution for high-reliability apps

ALISO VIEJO, USA: Microsemi Corp. announced a DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a compact x64/x72 unregistered dual in-line memory module (UDIMM )/small outline dual in-line memory module (SODIMM).

The solution provides up to 4GByte compact memory densities that support high-performance processors and chipsets in mission-critical applications such as avionics, UAVs, missile systems and other defense applications that require high reliability in harsh environments.

"With this expansion of Microsemi's DDR3 SDRAM family, we are able to provide a full range of high-performance memory products for today's demanding military applications," said Jack Bogdanski, director of marketing for Microsemi. "Product designers also benefit from the high-density packaging as it saves board space. This enables designers to include additional features and functionality into existing designs."

Microsemi's commercial off-the-shelf (COTS) DDR3 SDRAM devices give customers a standalone, high-density memory solution that also meets the data widths necessary for many applications. The DDR3 devices significantly reduce space requirements as compared to systems built from discrete memory components, and also use less board space than memory solutions using chip scale packages (CSPs) and other single-die solutions. Microsemi's memory devices also streamline I/O routing and reduce component count and placements while delivering superior signal integrity.