Friday, November 4, 2011

Mentor Graphics announces completion of 20 nm test chip tapeout with ST using Olympus-SoC place and route system

WILSONVILLE, USA: Mentor Graphics Corp. announced the successful tapeout of a 20 nm test chip in collaboration with STMicroelectronics, marking a significant milestone in the development of a complete Mentor design-to-silicon solution for next-generation process technology.

The test chip was implemented using the Olympus-SoC place and route system, and verified using the Calibre nmDRC platform, which is the verification and double patterning solution used by R&D teams at STMicroelectronics. Together, the Olympus-SoC, Calibre and Tessent silicon test and yield analysis products provide a comprehensive flow for 20 nm IC development.

“The Olympus-SoC place and route system has been proven on many tapeouts across multiple nodes and different application areas,” said Pravin Madhani, GM of Mentor Place and Route Group. “The 20 nm node has a unique set of new requirements including double patterning. Working with STMicroelectronics as a teaching customer and strategic investment partner in the DeCADE program has enabled us to make rapid progress in delivering advanced implementation solutions for 20 nm enablement.”

The Olympus-SoC place and route system is a complete netlist-to-GDSII system and is built on patented concurrent multi-corner multi-mode (MCMM) optimization, high capacity data model, advanced low power capabilities and integration with the Calibre platform for faster manufacturing closure. The OpenRouter architecture of the Olympus-SoC product enables native invocation of Calibre engines during design and uses the foundry signoff decks to ensure that the resulting layout is decomposable for multi-patterning, in addition to being DRC/LVS/DFM signoff clean.

“Increased process complexity and variability, lithography limitations, large design sizes and extreme low power add to the IC design challenges at 20 nm,” said Philippe Magarshack, group VP, STMicroelectronics Technology R&D. “Through the ISDA and the DeCADE joint development program, we are working very closely with Mentor Graphics on various aspects of 20 nm design enablement. We are pleased with the Olympus-SoC integrated platform’s ability to deliver a 20 nm place and route solution with high quality of results, which we recently demonstrated on a 20 nm test chip tapeout. We consider this to be a significant milestone toward demonstrating our 20 nm readiness.”

The joint-development project named DeCADE builds on advanced design solutions for SoC (System-On-Chip) development. DeCADE reinforces the Crolles cooperative R&D cluster, which gathers partners that develop and enable low-power SoCs and value-added application-specific technologies, and is a great example of a project developed within the framework of the Nano2012 program.

Nano2012 is a strategic R&D program, led by STMicroelectronics, which gathers research institutes and industrial partners and is supported by French national, regional and local authorities.

No comments:

Post a Comment

Note: Only a member of this blog may post a comment.