Tuesday, October 25, 2011

Microchip expands parallel flash memory portfolio with ultra-compact devices

CHANDLER, USA: Microchip Technology Inc. announced an expansion of its Multi-Purpose Flash Plus (MPF+) memory portfolio, with the introduction of the SST39VF80XC and SST39VF160XC. The SST39VF80XC offers 8 Mbit of memory, while the SST39VF160XC offers 16 Mbit of memory.

Manufactured with high-performance CMOS SuperFlash technology, these low-power, 3V, x16 parallel NOR Flash devices feature active current as low as 5 mA (typical) and standby current of 3 microamperes (typical). Besides offering exceptional reliability, these devices feature fixed program and erase times that do not deteriorate over time. The SST39VF80XC offers fast, 7 microseconds program time (typical) and access times of 55 ns and 70 ns.

Both devices offer industry-compatible command sets, and are ideal for use in applications such as consumer electronics (e.g. Bluetooth headsets, camera modules and gaming peripherals), automotive (e.g. car infotainment) and industrial (e.g. printers, alarms and meters). For applications that require reliable, low-power memory in compact packages, these new MPF+ devices are also available in an ultra-compact, 4 mm x 6 mm, 48-pin WFBGA package, which is the industry’s smallest footprint for packaged devices, in these densities.

“These new MPF+ products demonstrate our commitment to expanding our NOR Flash portfolio,” said Randy Drwinga, vice president of Microchip’s SuperFlash Memory Division. “These devices give our customers the small size, low power consumption and high performance NOR Flash they require for their applications.”

The SST39VF80XC starts at $0.68 each, in a 6 mm x 8 mm 48-pin BGA package, in 10,000-unit quantities. The device is also available in 4 mm x 6 mm 48-pin WFBGA and 12 mm x 20 mm 48-pin TSOP packages. The SST39VF160XC starts at $0.98 each, in a 6 mm x 8 mm 48-pin BGA package, in 10,000-unit quantities. The device is also available in 4 mm x 6 mm 48-pin WFBGA and 12 mm x 20 mm 48-pin TSOP packages.

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