Friday, October 21, 2011

Arasan Chip Systems demos industry's first UFS 1.0 link layer IP and hardware development platform

SAN JOSE, USA: Arasan Chip Systems Inc. has successfully demonstrated its UFS Link Layer IP and its associated UFS Hardware Development Platform (HDP) in the Mobile Memory Workshop hosted by JEDEC and TSIA in Hsinchu Taiwan on October 12th, 2011.

Arasan demonstrated its UFS 1.0 compliant UniPro on an FPGA, running full Gear 1 speed at 1.25Gbps on a Linux system during the UFS workshop. Following this exciting demonstration, Arasan will also demonstrate its MIPI® UniPro IP, the foundation of UFS Link Layer, on its Hardware Development Platform at ARM TechCon on October 25th, 2011 at the Santa Clara Convention Center, Santa Clara, California.

Arasan's UFS UniPro IP, based on its MIPI UniPro IP certified by UNH Lab, provides the link layer between the physical layer (PHY) and the protocol and application layers in UFS's layered architecture for next generation high speed and high capacity mobile storage.

Designed to be independent of the PHY layer, MIPI UniPro is a layered protocol for interconnecting devices and components within mobile systems such as cellular telephones, handheld computers, digital cameras, and multimedia Devices. UFS adopted MIPI UniPro to enable mobile devices, such as smartphone and UFS mobile storage devices, to utilize UFS PHY layer (i.e. M-PHY) in order to exchange data at high data rates, with low pin counts and at low energy per transferred bit.

With Arasan's UFS Link Layer installed on two FPGA-based HDP systems (one source and one device) next to each other, Arasan demonstrated the data transfer at 1.25Gbps (or Gear 1) between the source and the destination. With UFS UniPro, in an FPGA as the heart of the system, the HDP is designed to accelerate hardware development, software development and compliance testing.

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