CARLSBAD, USA: MaxLinear Inc., a leading provider of integrated radio frequency (RF) and mixed-signal integrated circuits for broadband communication applications, announced that ARRIS Group Inc., a global communications technology company, has selected the MxL261 dual-wideband tuner + quad demodulator for a new family of DOCSIS 3.0 consumer premise equipment (CPE).
The MxL261 is a unique dual-wideband tuner, quad QAM demodulator digital cable front-end chip with the ability to capture eight channels in two independent 100MHz input frequency bands located anywhere in the cable spectrum.
ARRIS is using the MxL261 in a full range of eight-channel DOCSIS 3.0 CPE including, the TG862 Wireless Gateway, the TM822 E-MTA, the TM804 four-line E-MTA, and the CM820 cable modem. The ARRIS Touchstone CPE products is a portfolio of solutions that support cable operators as they develop services for their upgraded DOCSIS 3.0 markets.
This line of products incorporates data-only modems, two and four-line E-MTAs, and integrated wireless voice and data modems. Several of the telephony-enabled products are equipped with battery back-up for emergency use during a power outage and diagnostic tools for remote fault detection for inside wiring, off-hook instances, or network challenges that may affect a subscriber’s experience. These features help cable operators ensure that they are providing the best quality service to their subscribers.
The MxL261 is based on MaxLinear’s low-power digital CMOS process-based RF and mixed-signal technology. It is a single-die, global standards digital cable front-end chip with an integrated low noise amplifier, two-way splitter, two 100MHz wideband tuners, four QAM demodulators and a four-channel wide intermediate frequency (IF) output. The MxL261 delivers ultra-low power at less than 175mW per channel in full eight-channel mode. The low-power consumption and the power control flexibility of the chip enable ARRIS battery-backed voice products to match time and standby time requirements with the lowest battery cell configuration. The MxL261 die is mounted in a 7mm x 7mm, 48-pin QFN package.
“We are pleased to be working with ARRIS on many of its flagship DOCSIS 3.0 products,” said Kishore Seendripu, MaxLinear’s CEO. “The ARRIS commitment to excellence and competitiveness fits perfectly with MaxLinear’s ideals, and the MxL261 provides a solution that meets their exacting standards for performance, quality and cost.”
“Our new line of DOCSIS CPE offers the very high levels of quality and performance that our customers always expect from us,” said Derek Elder, SVP and GM of the ARRIS Touchstone CPE business unit. “The MxL261 helps to meet those high standards, and the level of integration achieved in the chip plays a big part in making our 8 channel products competitive in the market.”
The MxL261 is shipping in high volume.