INDIA: Xilinx Inc announced the first shipments and availability of its Virtex-6 LX760 device.
As the industry’s largest FPGA available for delivery with immediate design tool support, the Virtex-6 LX760 device enables Xilinx customers who need raw logic density and industry-leading I/O performance to get started on their projects today using the Xilinx ISE® Design Suite 11.4.
“The Virtex-6 LX760 device offers more than two and a half times the density of the largest Virtex-5 device, so it was a natural choice for us as we transition to our next generation Rapid Prototyping platforms,” said Gary Meyers, vice president and General Manager of the Synplicity Business Group at Synopsys. “Receiving the first delivery of the LX760 devices accelerates our development and helps ensure that our customers receive the most advanced prototyping platforms at the earliest possible time.”
The Virtex-6 LX760 device is ideal for any application that requires intensive computational performance and high logic density. For example, the new large-capacity device enables designers to use a single-FPGA to prototype or emulate a greater range of ASIC designs than ever before.
In addition to high logic capacity, the LX760 device offers a higher I/O count than competing FPGAs to simplify the challenge of partitioning a large ASIC netlist across multiple FPGAs. Meanwhile, the ISE Design Suite version 11.4 reduces compile time by 30 percent to enable large, complex and highly utilized Virtex-6 designs as well as increased productivity through more design turns per day.
“Shipping the largest FPGA in the market demonstrates Xilinx’s ability to deliver leading edge architectures at the 40nm process technology node,” said Xilinx Senior Director of Marketing Patrick Dorsey. “As the industry’s leading FPGA product, each succeeding family of Virtex FPGAs enables our customers to more rapidly bring new applications to market by delivering new levels of capacity and performance.”
The Virtex-6 LX760 device leads the industry in its I/O count and embedded memory with 1,200 SelectIO pins and 25,920Kbits Block RAM to meet system partitioning as well as data buffering requirements.
In order to serve the needs of applications requiring the highest logic and embedded memory requirements, the LX760 device is optimized to tradeoff high speed serial transceivers for higher I/O, logic, and embedded memory capacity.