TriQuint copper flip technology powers world's most popular devices

HILLSBORO, USA: TriQuint Semiconductor Inc., a leading RF front-end product manufacturer and foundry services provider, highlighted the success of CuFlip, its patented flip chip interconnect technology, noting shipments of 100 million units.

CuFlip (pronounced Copper Flip) enables superior RF performance and design flexibility, and speeds manufacturing and assembly. TriQuint’s highest volume CuFlip product, the TQM7M5012, a HADRON II PA Module, utilizes this technology to power a variety of the world’s most popular consumer devices.

Evidence of the TQM7M5012 design flexibility can be seen in the vast array of products it supports. More than 30 customers have chosen it for everything from data cards, netbooks and e-readers, to Machine–to-Machine devices and many of the industry’s most popular 3G smartphones. Specifically, the TQM7M5012 is used by:
* Four of the top five mobile phone OEMs;
* Three of the world'’s top data card suppliers;
* Three of the top five smartphone manufacturers; and
* The world'’s most popular wireless reading device.

The TQM7M5012 is a 5x5mm HADRON II Polar EDGE PAM, which is 50 percent smaller than previous generations. This highly integrated module includes a power amplifier designed for GSM/EDGE wireless handsets and data devices in GSM 850/900/1800/1900 MHz bands. It supports both class 12 GPRS mode and E2 open loop polar EDGE mode, while delivering best-in-class current consumption and noise performance in the critical GMSK mode. This significantly improves handset battery life and thermal efficiencies.

The TQM7M5012 design flexibility is enabled in part by CuFlip, TriQuint’s unique interconnect technique. CuFlip employs uniform copper bumps to enhance product performance, reliability, and manufacturing scalability.

Unlike wire bonds, copper bumps enhance the thermal and electrical conductivity, allowing a more direct signal and better thermal path to the device without traveling through the epoxy and back-side gold-plated vias. Additionally, CuFlip can enable very low z height, offering a smaller overall footprint and lower height than competitive offerings to support ultra slim device designs.

CuFlip’s innate ability to mimic the streamlined assembly process of a standard surface-mount technology (SMT) component helps reduce cycle time and increase assembly line throughput. The uniformity of the copper pillars ensures precise manufacturing tolerance essential for higher parametric yields and optimal capacity utilization.

Stuart Laval, Product Marketing Manager for TriQuint Semiconductor, said: “CuFlip technology is a strategic differentiator for TriQuint. CuFlip enables superior RF performance and design flexibility. The CuFlip technique speeds manufacturing and assembly of the products, enabling cost savings we are able to pass on to our customers.”

TriQuint utilizes CuFlip in several forthcoming product lines including the QUANTUM Tx Module family for Dual-Band and Quad-Band, GSM/GPRS (2G) and GSM/GPRS/EDGE (2.5G) applications and the TRITON PA Module family for WCDMA/HSUPA applications. Both families of products are aligned with industry leading transceiver chipset vendors.