LAS VEGAS, USA: Synerchip Co. Ltd, a provider of innovative high-speed digital interface semiconductors, today announced that it is sampling the world’s first transmitter and receiver ICs compliant with the Digital Interactive Interface for Video & Audio (DiiVA) specification.
Providing the DiiVA functionality for prototypes showcased by brand leaders at the 2010 International Consumer Electronics Show (CES), Synerchip’s ICs are offered for design in now for CE products with production quantities available in mid 2010.
Elevating the home entertainment experience to a higher level, DiiVA enables consumer electronics devices to connect to one another in a network, carrying uncompressed video, audio, USB, Ethernet, content protection and power over a single low-cost cable.
The DiiVA network brings consumers the following advantages: establishes the TV as the point of interaction for all devices on the network, enables content-based versus connection-based navigation, offers shared internet and USB access to content, and provides integration of mobile and portable devices and support for 3D formats and 4K displays — making possible the ultimate intuitive and interactive digital entertainment experience.
Synerchip’s new family of products provides DiiVA support for the following home theater devices:
SCP1800 – DiiVA Receiver for digital televisions (DTVs), LCD monitors and digital signage.
SCP1801 – DiiVA Endpoint Transmitter for set-top boxes, Blu-ray/DVD players, game consoles and digital media adapters.
SCP1803 – DiiVA Daisy Chain Transmitter for the above source devices configured in a cascaded configuration.
“We are excited to supply manufacturing partners with semiconductor and reference software solutions that enable the delivery of DiiVA-based home entertainment networking devices to consumers around the globe,” said Synerchip CEO Dr. David Lee.
“Synerchip’s multi-gigabit PHY and switch architecture serves as the basis for the DiiVA specification, and by combining it with the necessary reference software and support services, we are setting the industry’s gold standard for DiiVA-compliant ICs. With a breakthrough interface capable of delivering a total of 18Gbps throughput with power at very low cost, consumers can soon look forward to a truly interactive entertainment experience throughout their homes.”
DiiVA combines a reliable, high-speed, bi-directional data channel with an uncompressed video and audio channel. While point-to-point interfaces such as USB and HDMI contain only a Physical and Link layer, DiiVA combines the Physical and Link layers with additional Networking and Transport layers to make DiiVA devices network-capable for use in personal domains enabling consumers an intuitive and interactive digital entertainment experience.
The typical DiiVA cable requires four twisted signal pairs making the wires compatible with standard CAT6 wires – enabling a low cost basis for DiiVA interface cables even at long distances.
The massive 13.5Gbps of bandwidth dedicated to uncompressed video meets and exceeds the demands of emerging 4K and 3D displays. Furthermore, DiiVA supports over 2Gbps aggregate bandwidth in the Hybrid Channel for bi-directional data (such as USB and Ethernet), audio, commands, and content protection.
Going a step further, DiiVA enables power sharing through the connection, keeping the link active even if devices are in standby mode. This aggressive power management capability automatically detects and powers down unused devices on the network — reducing power consumption and enabling a greener technology solution across networks of consumer electronics devices.
Enabled by Synerchip’s new ICs, the industry’s first DiiVA-enabled prototypes will be unveiled to key members of the home entertainment ecosystem in private booth #22025 at the 2010 International CES.
The SCP1800, SCP1801 and SCP1803 all come in an easy-to-use, cost-effective 144-pin LQFP package. Evaluation kits including the reference schematics, evaluation boards, and reference software are available to CE manufacturers ready to begin their product development efforts.