DURHAM, USA & ERFURT, GERMANY: Semprius Inc., a company commercializing its novel process for printing high-performance semiconductors, and X-FAB Semiconductor Foundries AG, the leading analog/mixed-signal semiconductor foundry, today announced a development agreement to provide turnkey silicon wafer fabrication for Semprius’ customers. Under terms of the agreement, X-FAB made a strategic investment of $1.5 million in Semprius and, effective immediately, will be the designated foundry for Semprius technology.
Semprius develops novel technology for the manufacture of advanced semiconductor devices. This technology enables “point-of-use electronics,” greatly broadening the options available to designers of advanced electronic devices. For many existing designs, the technology can enable a manufacturing process that is faster and far less expensive. It is ideal for multiple markets and applications, including solar modules, electronic displays and wireless devices.
X-FAB is the world’s leading analog/mixed-signal semiconductor foundry. Its large portfolio of foundry technologies range from advanced modular CMOS and BiCMOS platforms – with a broad spectrum of additional analog functions and modular options – to specialty technologies such as MEMS, BCD and SOI-based processes.
“The strategic relationship with X-FAB will provide our customers with ready access to world-class semiconductor fabrication in all aspects, from a Semprius-certified design kit to fully warranted wafer delivery,” said Joe Carr, President and CEO of Semprius. “We are delighted to be working with such a strong technology and service-focused partner.”
“Semprius’ expertise and innovative intellectual property position it as a key driver in the field of printed electronics,” said Hans-Juergen Straub, CEO of X-FAB. “Its advanced technology opens a multitude of new markets for our foundry business, and we foresee many areas of potential cooperation with Semprius.”