FlipChip and Fujikura announce ChipletT and ChipsetT embedded die packages

PHOENIX, USA: FlipChip International LLC USA (FCI) and Fujikura Ltd announced the ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.

ChipletT and ChipsetT package products are based on Fujikura's flex-based laminate embedded die WABE technology and will provide breakthrough cost-effective, ultra low profile packages by leveraging roll to roll flex fabrication processes and technological extensions including 3D, System in Package, RDL, Fan-In, Fan-Out, TSV and NanoPillar options. Use of WABE Technology will enable ChipletT and ChipsetT body thicknesses in the sub 250um range, up to 50 percent less than alternative embedded die solutions.

FCI and Fujikura will be exhibiting this new Product line at the Productronica Show in Munich, Germany from Nov. 15th to 18th.

ChipletT and ChipsetT will service the +$22 billion semiconductor packaging market with targeted end markets of Smart Phones, Tablets, Medical Diagnostics, Advanced Server Farms, Automotive, Security, Sensors and Photovoltaics where ultra-thin and very low cost chip packaging enables innovative products and designs.

ChipletT and ChipsetT provide a common package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density. The embedded flex based technology also delivers improved product reliability with improved system performance thereby conserving vital battery life.

Bob Forcier, FlipChip International CEO, said: "We are excited to announce ChipletT and ChipsetT to our customers and to the whole semiconductor industry. We believe that the ChipsetT family of packages set a new standard in miniaturization and will be a game changer for portable devices that relentlessly seek thinner profiles, longer battery life and higher functionality."

Takamasa Kato, executive VP and Member of the Board of Fujikura, said, "We believe that our WABE Technology, embedded die technology based on the extensive experience in flexible printed circuit technology, will deliver innovative and cost-effective solutions in this exciting area."