TI intros NexFET power block devices in 3 mm x 3 mm package

BANGALORE, INDIA: Texas Instruments Inc. (TI) has introduced a new NexFET Power Block device in a space-saving 3-mm x 3-mm SON package.

The new CSD86330Q3D Power Block package achieves greater than 90 percent efficiency at 15 A in half the area of competitive solutions that require two discrete power MOSFETs in 3-mm x 3-mm QFN packages. The Power Block has a significant advantage in power loss and output current capabilities over competitive solutions, and supports applications like servers, desktop and notebook PCs, networking equipment, cellular
infrastructure, high-end consumer applications and merchant power supplies.

Key features and benefits of CSD86330Q3D Power Block:
• 3-mm x 3-mm SON outline is half the size of two discrete MOSFETs in 3-mm x 3-mm QFN packages.
• Improves efficiency with only a 35°C rise in temperature at 15 A with no airflow.
• High power density saves up to 10 mm2 of board space.
• Double frequency without increasing power loss reduces output filter size and cost versus competitive solutions.
• The SON package with an exposed grounded pad simplifies layout and improves thermal performance.