TELEFUNKEN Semiconductors returns to IC business

HEILBRONN, GERMANY: TELEFUNKEN Semiconductors announced a re-entry into Integrated Circuits (ICs) with a focus on Power Management and high performance Interface. The newly released products emphasize power savings and are fabricated at Telefunken’s specialty Analog fabrication facility in Heilbronn Germany.

Proprietary processes such as SOI (Silicon-on-Insulator), a 700 Volt high-voltage process and a high-speed SiGe (Silicon-Germanium) process enable the new devices to meet the highest performance standards at the lowest power consumption.

“The technology industry, in fact the entire world is looking for the highest efficiencies without sacrificing performance”, said Dr. Volker Dudek, CTO at TELEFUNKEN Semiconductors. “With our specialty process capability we have a unique ability to address some of the technical challenges the industry is facing, such as supporting high voltages with minimal device parasitic.”

The first devices out of the gate at TELEFUNKEN are Interface devices, extended common mode LVDS drivers and receivers. LVDS (Low-Voltage-Differential-Signaling) is used extensively for routing data and video at high-speeds while requiring minimal power. Conventional LVDS has an attractive ratio of bandwidth to power consumption but is limited in distributed systems because of the relatively narrow common mode.

Telefunken’s extended common mode LVDS devices meet the full RS-485/422 common mode of -7 to +12V, compared to the LVDS standard of 0 to 2.4Volts. These new LVDS devices offer greatly improved bandwidth and a substantial reduction in power consumption and EMI compared to RS-485/422.

Typical applications for these types of product are Telecom box-to-box, Factory Automation, Instrumentation, Signage and Avionics. The quad drivers and receivers meet or exceed the LVDS standard while adding a tremendous amount of additional margin in the common mode.