Open-Silicon and Micron to deliver next-generation memory technology

MILPITAS & BOISE, USA: Open-Silicon Inc. and Micron Technology Inc. have entered into an agreement that will enable them to explore opportunities around Micron's recently announced Hybrid Memory Cube (HMC) products. The companies will initially focus on the data networking and high-performance computing markets.

Open-Silicon's depth of knowledge in these verticals and its broad ecosystem for ASIC, ASSP, and derivative IC development, combined with Micron's cutting-edge HMC technology, offer a unique opportunity to create next-generation memory solutions optimized for various markets.

Micron's HMC technology is a new architecture unique to the market today. It combines fast logic process technology with advanced DRAM, resulting in a memory system with revolutionary performance and power in a dramatically reduced footprint. As multi-core processing continues to advance semiconductor design to new levels, this technology provides memory and performance ideally suited to these next-generation systems.

"Open-Silicon offers the right mix of networking and computing architectural knowledge, semiconductor development expertise, and software and emulation services to support an expanding ecosystem developing around this new memory technology," said Robert Feurle, Micron vice president of DRAM Marketing.

"Micron has developed groundbreaking memory technology that will enable a new level of system performance and integration, as well as new classes of applications that we are only beginning to understand today. We are proud to work with Micron on supporting Hybrid Memory Cube technology, and are excited to know that these solutions will be valuable to the data networking and computing markets that Open-Silicon presently serves," said Naveed Sherwani, president and CEO of Open-Silicon.