SEMICON West 2011, ALBANY, USA: Through a wide range of lectures and workshop sessions, SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will present a variety of technology solutions and manufacturing methods from July 11–15 at SEMICON West in San Francisco, CA.
SEMATECH and ISMI experts will report their latest advances in new materials and device structures and lithography with a special focus on addressing key opportunities and challenges in 3D interconnect technology.
“Both SEMATECH and ISMI recognize that the industry needs innovative and practical solutions for continued scaling of semiconductor technologies that can easily be incorporated into real-world manufacturing environments,” said Dan Armbrust, president and CEO, SEMATECH. “This year’s SEMICON West will be an important forum for our industry to come together and find best ways to address complex technology challenges. We look forward to sharing our technical knowledge and best practices to help drive our industry forward.”
Wednesday, June 22, 2011
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