Microsemi achieves memory packaging technology "first" for demanding military system apps with DDR3 SDRAM device

IRVINE, USA: Microsemi Corp., a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, announced a 9Gb (gigabit) DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a compact x72 dual in-line memory module (DIMM).

The solution enables designers to pack up to 4GByte memory densities into smaller, faster systems used in mission-critical applications. These include secure communications, missile systems, munitions and other applications that operate in demanding environments and require extended-temperature ranges.

"Microsemi's DDR3 SDRAM packaging further strengthens our industry-leading offering of custom and standard high-reliability, extended-temperature memory solutions," said Jack Bogdanski, director of marketing for Microsemi.

"We have more than three decades of experience in packaging techniques for military and aerospace applications. We will continue to focus on providing our customers with high-performance, high-reliability solutions that solve space and density issues."

Microsemi's commercial off-the-shelf (COTS) DDR3 SDRAM devices give customers a standalone, high-density memory solution that also meets the data widths necessary for their applications. The DDR3 devices significantly reduce space requirements as compared to systems built from discrete memory components, and also use less board space than memory solutions using chip scale packages (CSPs) and other single-die solutions. The memory devices also streamline input/output (I/O) routing and reduce component count and placements while delivering superior signal integrity.