Tektronix Component Solutions increases ASIC and FPGA test capacity

BEAVERTON, USA: Tektronix Component Solutions announced that the investment in five new Teradyne J750EX semiconductor test systems to allow screening of a wider variety of complex ASICs, increase test capacity and enable faster development of new test programs. Reducing development time will improve time-to-test for customers and reduce development cost.

The addition of the popular Teradyne systems will significantly expand the company's test and screening services for high-density and high-speed ASICs and FPGAs for military, space, and commercial aerospace customers. Furthermore, the new systems can provide memory testing of digital devices up to 384-pins and test increasingly complex digital ICs. Typical application areas include full characterization of off-the-shelf parts at extended temperature ranges, verifying that device performance meets demanding military, aerospace or space standards.

"We're making a significant capital investment to better serve the needs of the high-performance mil-aero market," said Tom Buzak, president, Tektronix Component Solutions. "We are fully committed to equipping our labs with state-of-the-art technology. The Teradyne test systems will help decrease test development time, reducing the cost of test for our customers while enabling the screening of increasingly complex devices."