FREMONT, USA: Mattson Technology Inc., a leading supplier of advanced process equipment used to manufacture semiconductors, announced that a leading Asian foundry has selected the Helios XP rapid thermal processing (RTP) system for the manufacturing and development of advanced logic devices. Volume production and revenue are expected to begin in 2011.
"The selection of the Helios XP for this leading foundry's logic production fab demonstrates that our latest RTP tool is making progress in further penetrating the critical foundry and logic segments," said Andreas Toennis, senior VP and GM of Mattson Technology's Thermal Products Group.
"The Helios XP is ideally suited for a high-volume, foundry manufacturing environment because of its ability to execute the full range of RTP applications for logic manufacturing at advanced technology nodes, as well as its strength in meeting the stringent requirements of next-generation RTP processes."
Toennis continued: "The Helios XP's unique HotShield technology is a key differentiating feature that provides reduction of pattern loading effects to improve yields on our customers' production of logic devices and enables the successful implementation of advanced processes, including critical spike anneal and nickel silicide applications.
"We are confident that this leading foundry customer will continue to choose the Helios XP for its ability to provide significant advantages in productivity, advanced processing performance, and manufacturing flexibility to meet its most demanding manufacturing challenges."