NEW TRIPOLI, USA: Last week during my Semicon presentations, I noted on one of my slides (send me an e-mail and I will send you the presentation) to beware of Disruptive Technologies. I discussed it in light of the solar manufacturing portion of my presentation Niche Market Opportunities for Small and Mid-sized Companies.
I had the opportunity to meet with Alchimer S.A., a French company that offers a Disruptive Technology for through-silicon-via (TSV) packaging, which was another topic I spoke on. The company’s electrochemical deposition technology, according to them, reduces overall cost of ownership for high-aspect-ratio TSV metallization by up to two-thirds compared to conventional dry processes.
In early 2010, Alchimer announced a multilevel collaboration with KPM Tech Co. Ltd., a South Korean manufacturer of plating materials and systems. KPM Tech obtained exclusive rights to produce chemicals in Korea for Alchimer's technology. Alchimer does not design tools. It is pushing a wet chemistry technology. KPM is devising a tool or platform that supports the wet chemistry.
In our experience working with small and mid-sized companies, disruptive technologies are difficult to get into production. Why? The main reason is that companies expect mainstream manufacturers of devices to make all changes at once using their technology. We have instructed our often overly enthusiastic, overly optimistic, clients who have offered disruptive technologies of their own to make incremental modifications to a manufacturer’s production line. It takes longer, but the rewards are greater.
We project the TSV market to be huge, and deposition makes up a substantial portion of the market, as shown below. Entrants in the area include Applied Materials, NEXX, Novellus, and Tegal.
Source: The Information Network.
No comments:
Post a Comment
Note: Only a member of this blog may post a comment.