StratEdge intros leadless, low-profile, hermetic, SMT packages

SAN DIEGO, USA: StratEdge, a leader in the design and production of semiconductor packages for microwave, millimeter-wave, and high speed digital devices, has introduced a new family of fully hermetic, low-profile, leadless surface mount (SMT) packages with improved electrical performance.

The SM family of packages fits aerospace, avionics, automotive, and telecom industry applications and is especially suited for LEDs, MEMS, and optical devices.

These new packages incorporate a metal plug in the base that allows a direct ground path for enhanced electrical performance. Anticipated performance is DC to 30+ GHz. The first package offered has a 5 x 5mm outer dimension and 28 I/Os. There are plans for other configurations including packages with 4 X 4mm, 6 x 6mm, and 8 x 8mm outer dimensions.

All SM packages meet stringent MIL-STD requirements for hermeticity. Additions to the SM Family will be offered as standard products, with samples and volume production quantities available in Q3 of this year.

The SM packages match industry-standard outlines enabling them to be used as direct replacements for traditional quad flat package designs. They can be used in place of plastic over-molded packages in applications where an air cavity is desired.

The air cavity provides improved microwave performance, allows for ease of rework and repair, and is ideal for prototyping. In addition, air cavities are often necessary for sensors and other devices that need to respond to movement.

Tim Going, StratEdge president, said, “StratEdge’s new SM packages give designers an alternative to plastic over-molded packages, enable them to get superior electrical performance, and are cost effective because of the ease of repair and rework.”