MILCOM, BALTIMORE, USA: Raising the bar on performance and precision standards for mission critical applications, Texas Instruments Inc. (TI) is offering developers the industry's highest performing multicore digital signal processors based on its TMS320C66x DSP generation.
Ideal for applications such as software defined radios (SDRs), radar, surveillance and imaging cameras, TI's C66x DSP generation offers developers a variety of multicore solutions and capabilities, combined with an expanded array of IP cores and development software and tools, enabling sophisticated system architectures that are both power- and cost-efficient. With TI's C66x multicore DSPs, developers can more effectively meet the essential requirements of increasing processing power, accuracy and finer resolution in mission critical applications.
"The defense sensor processing market has an almost endless thirst for computational power often with the need for low power devices," said Bill Lundgren, CEO, Gedae Inc. "The high bandwidth on-chip data, available on-chip memory, flexibility of a MIMD multicore and massive available compute bandwidth make this family of multicore DSPs from TI very appealing for mission critical applications."
Meeting the needs of mission critical developers
Functionality, reliability and ease of use are vital factors mission critical developers must take into consideration when designing quality system applications. TI's C66x multicore DSPs deliver the industry's first 10-GHz DSP with fixed- and floating-point performance on a single device for increased precision, a key requirement for mission critical systems.
Additionally, C66x multicore DSPs increase system capabilities by consolidating the functionality of multiple DSPs onto a single device, saving board space and cost and alleviating the challenge of size, weight and power (SwaP), as well as reducing overall clock rates and power consumptions.
TI's multicore DSPs also address interface bandwidth requirements, such as SRIO, PCIe and Hyperlink. And for those applications required to work under extreme physical conditions, such as scorching temperatures and sustaining system long shelf life, TI's multicore solutions offer lead solder ball packages at industrial temperatures, making the C66x family highly reliable and useful in mission critical applications.