Hynix joins SEMATECH’s 3D interconnect program at UAlbany NanoCollege

ALBANY, USA & SEOUL, KOREA: Hynix Semiconductor Inc. announced Hynix has become a member of SEMATECH’s 3D Interconnect program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

Hynix will collaborate with engineers in SEMATECH’s 3D Interconnect program at CNSE’s Albany NanoTech Complex to address industry infrastructure and technology gaps in materials, equipment, integration and product related issues for high volume adoption of through silicon vias (TSV).

Volume implementation of wide input/output (I/O) memory based products is gaining significant momentum in the industry. Worldwide academic and industrial research activities are currently focusing on developing new and improved technologies and the stacked wide I/O DRAM for mobile applications. Successful deployment of wide I/O and TSV combination will enable heterogeneous 3D integration and volume production of 3D based products.

Hynix and SEMATECH are uniquely positioned to address commercialization challenges and to lead the industry in enabling wide I/O interface structures using TSVs for high volume manufacturing within the next two years.

“3D integration offers a path for higher performance, higher density, higher functionality, smaller form factor, and potential cost reduction,” said Dr. Sung Joo Hong, Head of R&D Division of Hynix Semiconductor. “By joining SEMATECH’s 3D Interconnect program and collaborating with industry-leading partners, we expect to play a critical role in accelerating the commercialization of wide I/O DRAM and to realizing 3D’s potential as a manufacturable and affordable path to sustaining semiconductor productivity growth.”

“The need for cooperation across the industry in order to achieve 2013 HVM for the wide I/O DRAM is critical for memory manufacturers,” said Raj Jammy, vice president of emerging technologies at SEMATECH. “We are excited by this opportunity to partner with a leading memory maker like Hynix. With such partnerships, SEMATECH’s leading edge R&D capabilities, and advanced 3D IC know-how will contribute to the growth of the semiconductor industry.”

“We are delighted to welcome Hynix Semiconductor to the growing ranks of global companies attracted by the SEMATECH-CNSE partnership to conduct leading-edge nanoelectronics research and development at the UAlbany NanoCollege,” said Richard Brilla, vice president for strategy, alliances and consortia at CNSE. “This will further build the state-of-the-art capabilities at CNSE’s Albany NanoTech Complex to enable the innovative technologies that are critical to serving the needs of industry.”

Through technology leadership and global collaboration, SEMATECH’s 3D Interconnect program emphasis is on exploring 3D technology options that provide cost-effective and reliable solutions to drive manufacturing readiness of 3D TSV.