LeCroy intros new half-size mid-bus probe for PCI Express 3.0

IDF 2010; SAN FRANCISCO, USA: LeCroy Corp., a leading supplier of oscilloscopes and serial data test solutions, introduced a new half-size mid-bus probe for the Summit T3-16 Protocol Analyzer, supporting the PCI Express 3.0 specification (8 GT/s data rates). The mid-bus probe can be connected to systems that utilize the half-size mid-bus probe footprint specification.

Mid-bus probes are used by system developers to probe embedded bus signals (e.g., for serial data buses that run between chips on a single circuit board), or simply as a convenient means to access bus signals with a probe connector. The probe is easily attached to an anchor connector mounted on top of a mid-bus footprint that is laid out on the test target system board.

Previously, LeCroy had introduced a full-size version of the mid-bus probe. This new LeCroy mid-bus probe uses a half-size connector that supports PCIe x4 lanes at 8 GT/s. This smaller probe can be used in conjunction with the unique lane swizzling feature on the Summit T3-16 Analyzer, which allows probe signals to be reorganized logically, to give developers flexibility in PCB layout.

"LeCroy is making sure that PCI Express developers have the broadest coverage of probing connectivity options," said John Wiedemeier, Product Marketing Manager, LeCroy. "The half-size mid-bus probe addresses applications that use x1 and x4 lane sizes. Chip Prototyping and add-in card development will be a prime user of this new connector type."

LeCroy protocol analyzers have been at the forefront of PCI Express development tools. All LeCroy protocol analyzers feature a hierarchical display, real-time statistics, protocol traffic summaries, detailed error reports, powerful scripting, and the ability to create user-defined test reports, which in combination provide a powerful analysis system to allow developers to troubleshoot intricate problems and to finish their projects on time.

The half-size mid-bus probe is now available to order.