PHOENIX, USA: FlipChip International (FCI) has been granted the ISO/TS 16949 certification at both its Bumping Facility in Phoenix and Die Sales Division in Tempe, Arizona.
ISO/TS 16949 is an ISO technical specification designed to be more stringent than current ISO 9001 quality management system requirements, and has its origins in the automotive industry.
The goal of ISO/TS 16949 is the development of a quality management system to provide for continual improvement, emphasize defect prevention, and to reduce the variation and waste in the supply chain. ISO/TS 16949 incorporates and goes over and above all ISO 9001 standards, which are currently common place in the semiconductor industry.
Bob Forcier, CEO at Flip Chip International, said: "We are proud at FCI to have an exceptional customer base who demand first class quality, technology, service and innovation from our facilities worldwide to enable them to compete in today's global marketplace. Our recent ISO/TS 16949 certification at our Arizona facilities is another step in ensuring our systems and processes meet and exceed our customers' needs and expectations."