Alvand announces 40nm ultra low power, small die-area ADC IP solution

SANTA CLARA, USA: Alvand Technologies Inc., a leading provider of mixed-signal ASIC and IP solutions, announces the production-readiness of the industry’s lowest power, smallest die-area analog-to-digital converter (ADC) intellectual property (IP) for advanced digital TV (DTV), digital imaging and wireless/wireline LAN applications.

Designed in leading 40nm manufacturing process node, the ALVADC10_165M40THLA IP solution from Alvand is a robust 10-bit, 165 Mega-samples-per-second (MSPS) pipeline ADC that features excellent dynamic range performance, with a signal-to-noise ratio (SNR) of 56 dBFS, and high immunity to substrate noise.

Alvand’s ALVADC10_165M40THLA is one of the industry’s lowest power IP. It consumes 13mW at 165MSPS, which represents a 2x to 3x power savings over competitive offerings. In addition, Alvand’s IP solution features the industry’s one of the smallest die area of 0.06mm2 in 40nm, which is up to 5x smaller than competitive solutions, as well as having small pitch of about 150um.

The combination of ultra low-power and small die area enables customers to develop high-performance systems that require a high density of multi-channel ADCs on chip, as well as highly energy efficient solutions for power-sensitive portable and mobile devices.

Based on Alvand’s patented ADC technology, the best-in-class ALVADC10_165M40THLA IP has been integrated successfully and will soon be ramping into production. The ALVADC10_165M40THLA IP complements Alvand’s existing portfolio of high-performance, ultra low-power ADC and analog front end (AFE) IP solutions that are shipping in volume production by multiple customers.

“We are committed to deliver high-performance, ultra-low power and small die-area A/D and D/A converters in advanced technologies,” said Mansour Keramat, President and CEO at Alvand Technologies.

“This is the fifth consecutive process node (180nm, 130nm, 90nm , 65nm and now 40nm) in which we have demonstrated clear market and technology leadership in advanced ADC solutions, as evidenced by multiple industry recognitions we have received, and we expect our leadership to continue into the 28nm node soon.”