Phil Garrou joins Yole Développement 3D packaging team

ALLENDALE, USA: Yole Développement announced the addition of Dr. Philip Garrou to their consulting team as Senior Technical Analyst for 3D Packaging. Under the exclusive agreement Dr. Garrou will contribute to the team of four analysts covering this topic at Yole and will author original research reports and contribute to existing reports building on and adding to Yole’s growing reach into the advanced packaging area.

From 2000 –2004 Dr. Garrou was Global Director of Technology and New Business Development for Dow Chemical in their Advanced Electronic Materials business. From 1997–2002 he was General Manager of Dow’s BCB dielectric business. Dr. Garrou is a fellow of both IEEE & IMAPS and has served as President of the IEEE Components, Packaging and Manufacturing Technology Society.

He is currently Contributing Editor and blogger (“Insights from the Leading Edge”) for Solid State Technology. He has authored / co-authored more than 100 technical publications and texts including the Multichip Module Handbook for McGraw Hill in 1998 and the Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits for Wiley-VCH, 2008.

His list of awards and achievements are many. Most recently: in 2000 he received the IMAPS William Ashman award for “… technical achievement in Microelectronics Packaging”; in 2002 he was awarded the Fraunhofer IZM International Adv Packaging Award for “pioneering achievement in the introduction of new thin film polymeric packaging materials”; and in 2007 the IEEE CPMT Sustained Technical Achievement Award for “for 25 years of technical contributions and leadership in thin film dielectric materials and microelectronic applications including multichip modules, bumping and wafer level packaging, integrated passives and 3D integration”.

Dr. Garrou received his B.S. degree in Chemistry from North Carolina State University (1970) and his PhD degree in Chemistry from Indiana University (1974).