Infineon X‐GOLD 213–eWLB package -- first reverse analysis report of a fan‐out wafer level package

LYON, FRANCE: LYON, FRANCE: System Plus Consulting released its new reverse costing analysis of the enhanced Wafer Level BGA (eWLB) packaging used in the X‐GOLD 213 circuit from Infineon. This report is commercialized by both System Plus Consulting and Yole Développement.

In 2008, Yole Développement and System Plus Consulting signed a business agreement whose purpose was to broaden the marketing and technological offer of both companies.

System Plus Consulting is proud to publish the reverse costing report of the enhanced Wafer Level BGA (eWLB) package used in the X GOLD 213 circuit from Infineon. eWLB is a Ball Grid Array package based on the emerging Fan‐Out Wafer Level Package(FO‐WLP) concept.

All the packaging operations are done at the wafer level, and a fan-out area is provided, which extends the package size beyond the IC surface area to allow for higher ball counts. The ball pitch is 0.5mm and only one redistribution layer is used for this 217 balls 8x8 mm package.

The eWLB is manufactured on200 mm wafers by Infineon who licensed the technology to ASE and STATS ChipPAC.

System Plus Consulting’s reverse costing analysis provides for a complete teardown of the XGOLD213 eWLB package including: detailed photo, material analysis, manufacturing process flow, in‐depth economical analysis, manufacturing cost breakdown, selling price estimation.