Tanner EDA, Sound Design in PDK collaboration for thin film technologies

MONROVIA, USA & BURLINGTON, CANADA: Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal ICs, and Sound Design Technologies (SDT), a leading designer and manufacturer of integrated passives and stacked-die assemblies, are collaborating to develop process design kits (PDKs) for analog/mixed-signal (A/MS) designers using Tanner EDA’s HiPer Silicon software.

This collaboration gives Tanner EDA customers access to SDT’s innovative SiPArray integrated passives technology and SDT customers access to Tanner EDA’s A/MS tools for a complete IC design solution.

“Tanner EDA offers a perfect blend of productivity, price-performance and interoperability that is ideally suited to the needs of our analog/mixed-signal IC design customers,” stated Ian Roane, president and CEO of Sound Design Technologies.

“Our collaboration with Tanner EDA provides our mutual customers with an advanced design platform and powerful design capabilities to integrate passive components into stacked die assemblies to reduce board space. This will enable them to capitalize on advanced 3D packaging capabilities for breakthroughs in miniaturization and high performance solutions.”

“Our collaboration with Sound Design Technologies is another example of enabling innovation by bringing leading-edge process and packaging capability to our customers,” commented Tanner EDA’s president, Greg Lebsack. “Our specialized IC design software combined with SDT’s integrated passives and chip-stacking technologies arm A/MS designers with breakthrough capabilities to simultaneously save space, improve quality and reduce power requirements.”

Sound Design Technologies’ PDKs for Tanner Tools will be available in Q1 2010.