X-FAB to exhibit foundry solutions for designers of power electronics

PALM SPRINGS: X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies, will present its high-performance power management solutions in 0.18, 0.35 and 0.6 micron technologies, in Booth #539 at the APEC Conference and Exposition, Palm Springs, Calif., Feb. 21-25, 2010.

These solutions are ideal for applications such as precision analog, light source driving, sensor front ends, battery management and mixed-signal SoCs. X-FAB also will discuss its new modular Bipolar CMOS DMOS (BCD) process – XHB06 – optimized for applications requiring operating voltages up to 30V.

With only 13 mask layers in the baseline process, it addresses customer needs for smaller chip area, less design effort, more flexibility and faster time-to-market. The XHB06 process is ideal for power management, radio frequency (RF) circuits and high-precision mixed analog/digital applications in telecommunications, consumer electronics, automotive and industrial products.