Mistral’s product design expertise enhances Kopin’s Golden-i developers kit

BANGALORE, INDIA: Mistral Solutions, a leading provider of technology solutions and professional services in the embedded space, congratulated Kopin Corp. on the launch of its Golden-i platform and is a strategic partner in the development of this game changing product that is set to redefine mobile computing and communication.

Kopin, a leader in micro displays for consumer and military applications, contracted Mistral to be a part of this prestigious project, drawing on Mistral’s extensive experience with OMAP35x processors from Texas Instruments (TI).

Mistral collaborated with TI on the OMAP35x evaluation module (EVM) and is one of the most popular development platforms for OMAP-based product development. It has been a starting point for Mistral to build development partnerships with various customers.

Golden-i is a light-weight headset (three to six ounces) that provides both wireless Bluetooth/WiFi connectivity with a near-eye virtual 15-inch PC display that facilitates spontaneous, handsfree mobile communication and computing. It integrates advanced voice/gesture recognition technology, allowing users to remotely control up to seven independent devices and networks at one time – cell phones, handhelds, PCs, industrial and enterprise systems.

For the Golden-i project, the team at Mistral integrated the powerful OMAP3530 processor, with WiFi, Bluetooth and various other peripherals, along with the Kopin’s micro display to deliver an optimized solution in a low-power, ultra-small form-factor design. The team also developed an automated test suite for hardware design validation and manufacturing test.

Being a single source for hardware and software expertise, Mistral offers its customers, custom design services expertise that helps customers save on valuable development time and costs. Mistral's professional services include:

* Hardware design including development boards, reference designs and form-factor product designs.
* Operating system porting with embedded Linux, Windows® Embedded CE, Android and related board support package (BSP) and device driver development.
* Middleware integration supporting integration of DSP codecs, Bluetooth stacks, Wireless LAN stacks and other middleware.
* Embedded application integration building end devices that integrate hardware and software features into a compelling product.