TI, Azcom and Nash announce availability of physical layer femtocell reference design supporting up to 32 users

BANGALORE, INDIA: Texas Instruments Inc. (TI) announced the availability of a 3GPP voice and data physical layer reference stack for UMTS femtocell products designed for Release 6 and 7 compliance at the Mobile World Congress in Barcelona.

The new platform is based on TI’s System-on-a-Chip (SoC) solutions, and developed in collaboration with Azcom Technology, a leader in providing cellular communications software solutions, and Nash Technologies, a wireless communication system development and support company.

The scalability of TI’s SoCs and PHY libraries, and Azcom’s and Nash’s femtocell physical layer software, along with services from system integration to field support, will allow equipment manufacturers to quickly develop picocell and femtocell products for the enterprise and residential markets.

“As the femto market expands and customers’ requirements evolve, TI continues to invest in DSP and analog solutions, as well as PHY libraries, to support the infrastructure vendors deploying our solutions worldwide,” said Dr. Arnon Friedmann, strategic and technical marketing manager, wireless base station infrastructure business, Texas Instruments.

“With Azcom and Nash using our libraries as the foundation for their high performing PHY layer software, OEMs can benefit from more efficient processing with a standards-based proven set of code and platform extensibility, ultimately getting to market more quickly.”

The UMTS voice and data femto PHY addresses the need for a ready to use, fully featured and high capacity UMTS femto NodeB software stack, which is fully customizable and compatible with industry standards. It is designed to operate on TI’s high-performance processors with an initial implementation on the TMS320TCI648x series of wireless base station infrastructure devices.

The Femto PHY Processing Layer provides highly performing receive and transmit functionalities. The proprietary rake receiver gains advantage from hardware acceleration offered by TI provides best-in-class channel processing capacity.