Tuesday, February 1, 2011

TriQuint announces next gen multi-mode power amplifier module for Qualcomm’s 3G/4G chipset

Mobile World Congress 2011, HILLSBORO, USA & BARCELONA, SPAIN: TriQuint Semiconductor Inc., a leading RF front-end product manufacturer and foundry services provider, announced availability of its first Multi-Mode Power Amplifier (MMPA) module developed for Qualcomm’s 3G/4G chipset solution.

The TQM7M9023, a member of the TRIUMF Module family, combines with TriQuint’s industry leading TRITIUM PA-Duplexer Module family to offer a complete RF system solution for smartphones and other mobile devices.

Tim Dunn, VP and GM of Mobile Devices at TriQuint noted: “The TQM7M9023 is an important addition to our product portfolio. It integrates WCDMA functionality around our core competence of GSM/EDGE power amplifiers while providing customers a flexible, high performance platform solution to meet the increasing band count combinations in 3G/4G handsets. Our ability to integrate passive and active devices into high performance system solutions continues to propel TriQuint’s value in the smartphone market.”

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