Friday, April 23, 2010

Sonics showcases on-chip connectivity solutions at Multicore Expo

MILPITAS, USA: Sonics Inc., a premier supplier of intelligent on-chip communications solutions, will feature its on-chip connectivity products at Multicore Expo, April 26-29 at the McEnery Convention Center, San Jose, in booth #2402.

The company will demo its newest on-chip network product, SNAP (Sonics Network for AMBA Protocol), that supports both homogeneous and heterogeneous multicore SoCs. The SNAP tool provides a simple yet powerful environment to capture and optimize on-chip networks for a wide-range of multicore SoCs.

“While others talk about solving multicore issues, Sonics has actually been providing multicore SoC solutions to designers for more than 10 years,” said Jack Browne, senior vice president of sales and marketing.

“We help SoC designers turn an on-chip network design into an IP block, which reduces engineering resources, decreases time-to-market, optimizes system performance and facilitates IP reuse. Ultimately, we provide the glue to use any IP, anytime, anywhere.”

Top semiconductor and consumer electronics companies around the world have incorporated Sonics’ solutions into a variety of products, including smart phones, HDTVs, slate computers, netbooks, wireless routers, game consoles, and more.

“Sonics has been a long-time innovator of multicore solutions and we’re proud to have them participate at Multicore Expo,” said Markus Levy, conference chair. “Conference attendees should visit the Sonics booth to learn more about the company’s solutions for simplifying complex multicore SoC designs for the highest speed video, and embedded wireless applications, among others.”

In order to serve a broad customer base, Sonics works with market-leading companies to support the entire ecosystem needed for complex SoC development. They include EDA vendors that provide tools for architecture design and exploration, along with SoC assembly and test. Sonics also works with other IP vendors that provide customers with complementary IP products such as processors and memory subsystems.

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