GRAZ, AUSTRIA: SensorDynamics, a manufacturer and supplier of micro and wireless semiconductor products, announced the launch of its new two-axis and three-axis gyroscopes.
The patented sensor elements are fabricated by the proven PSM-X2 MEMS process, which is available for 8 inch wafers since January 2010. They create new perspectives regarding pricing, reliability and miniaturization both as standalone components and combined with a 3D accelerometer.
SensorDynamics will offer the 2D and 3D MEMS gyroscopes in May 2010 as standalone products for use in applications in industry, automation engineering, medicine and navigation, plus the high-end consumer spectrum. An automotive version for the -40°C to +125°C temperature range that is certified to AEC-Q100 is on the roadmap.
Produced using dual-cavity technology likewise patented by SensorDynamics, the new 3D gyroscope is going to be integrated with a 3D accelerometer next. The result will be a complete inertial measurement unit with six degrees of freedom — a 6DoF IMU — on a few square millimeters of chip space. A suitable product for the consumer sector is due to follow within the next months.
The characteristics of these multi-axis gyroscopes correspond to those of the single-axis elements of the SD75x, SD70x and SD77x/78x product lines, which are already in volume production, but the greater density of integration means significant cost advantages in comparison.