Brite Semiconductor, Open-Silicon and HiSilicon announce silicon success of 65nm wireless network chip

SHANGHAI, CHINA: HiSilicon Technologies Co. Ltd, Brite Semiconductor (Shanghai), Inc., and Open-Silicon Inc. have successfully completed a 65nm wireless network SoC design with a TSMC foundry process.

The SoC achieved first pass silicon success and taped out within a short schedule requirement (four months from physical design start to tape-out) to meet business conditions. The product returned from the fab and the silicon met all the performance requirements, having been tested in HiSilicon's lab.

The telecom SoC is highly complex, containing 100M gates, more than 8 cores, an 800MHz high-speed clocking system, and 3.125G high-speed interfaces.

The Brite Semiconductor design team, which organized and executed the project, included experienced engineers from multiple Brite Semiconductor and Open-Silicon locations (Bangalore, Milpitas, CA, and Shanghai). Well-defined initial planning and excellent ongoing project management proved the most important factors for the success of the project within such a tight schedule.

"This 65nm project showed how Brite's technologies and project management capabilities can be used to achieve top performance in a standard ASIC implementation," stated Dr. Charlie Zhi, CEO and President of Brite Semiconductor (Shanghai). "Brite proved itself again by providing our customers with a predictable product completion time which improves the competitiveness of their products."

"While there may be other similarly complex projects in North America, completing such a chip in just four months with absolute silicon success is quite rare," said Dr. Naveed Sherwani, CEO and President of Open-Silicon. "Open-Silicon was proud to work with our partner Brite Semiconductor to demonstrate our high performance technology and to provide our custom low-cost and high-reliability ASIC design service."

"The preciseness, cooperation and advanced design flows provided by Brite Semiconductor and Open-Silicon guaranteed the successful tape-out of this SoC design on schedule. The two companies once again demonstrated their abilities and have received accolades from both partners and colleagues in the industry," said VP of HiSilicon, Tingbo He.