Micron samples single-sided DDR3 DRAM module

USA & CHINA: Micron Technology Inc. and TE Connectivity (TE) announced the availability of a single-sided SODIMM and a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector solution to take advantage of the burgeoning market for Ultrabook devices, convertibles, tablets and other thin and light devices.

Aimed at providing a reduced-height memory solution for the ultrathin computing market, the single-sided SODIMM, developed by Micron, has components on either the front or back side of the module, but not both. When paired with the single-sided DDR3 SODIMM connector from TE, the total z-height of the overall solution from the motherboard is just 3mm, a 35 percent savings compared to 4.6mm for a standard SODIMM solution.

Micron's single-sided SODIMM is available in a 4GB, single-rank, x8 configuration. In addition to a reduced height, this new module is built using 30nm DDR3L-RS components that consume less power in standby compared to standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible with current DDR3 modules, making them backward compatible with existing DDR3 SODIMM connectors.

TE engineers designed the new single-sided DDR3 SODIMM connector to deliver peak performance with high-speed data applications. The connector features a 35 percent reduction in height, compared with similar low-profile connectors, which in turn, reduces the height of the end-product by 5 to 10 percent. It also reduces motherboard shadow area by nearly 156 mm2, or 312 mm2 for common dual-socket implementation. The DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards and is offered in both standard and reverse types.

Single-sided SODIMM samples are available from Micron now, with mass production scheduled for Spring, 2013. Single-sided SODIMM connector samples are available from TE Connectivity now, with mass production scheduled for June, 2013.